PCB layout is where your schematic becomes a physical reality. XbayChip's layout engineers specialize in dense, high-speed, multi-layer board designs for industrial, communications, and defense applications. We support 2 to 20-layer PCBs with blind and buried via technology, delivering an average of 400 Pins per day. Our designs are built to operate reliably from -40°C to 85°C, with robust anti-interference design that meets stringent EMI/EMC standards. Whether you need a compact SOM, a high-density SBC, or a complex backplane, we ensure your layout is electrically sound, manufacturable, and optimized for performance.
Expert design of 2 to 20-layer boards with advanced stack-up planning, blind/buried via technology, and careful layer assignment for signal, power, and ground integrity.
High-speed signal routing for DDR, PCIe, SRIO, JESD204B, and other critical interfaces — with length matching, skew control, and topology optimization for signal integrity.
Precise impedance-controlled routing with stack-up engineering, dielectric material selection, and simulation-verified single-ended and differential impedance targets.
Comprehensive electromagnetic compatibility design including shielding strategies, filter placement, ground plane partitioning, and emission suppression to pass CE/FCC certifications.
We follow a disciplined, stage-gated layout workflow that combines engineering precision with design-for-manufacturing best practices — ensuring every board we deliver is production-ready.
We establish the complete design rule set — layer stack-up, trace width/space, via types, impedance targets, and DFM constraints — aligned with your chosen fabricator's capabilities.
Strategic component placement optimizes signal paths, thermal dissipation, mechanical fit, and assembly accessibility — with critical components positioned for best electrical performance.
Manual and auto-assisted routing of all nets, with special attention to high-speed buses, differential pairs, power distribution, and return path continuity for signal and power integrity.
Full DRC, DFM, and signal integrity verification — including impedance checks, crosstalk analysis, and thermal review — to catch and resolve every issue before tape-out.
We generate complete, fab-ready Gerber files, drill files, pick-and-place data, and assembly drawings — fully documented and verified for seamless handoff to your manufacturer.